Aluminum nitride heating ceramic plates are heating elements or heater carriers made using aluminum nitride ceramics as the substrate or core component.
MATERIAL
Al2O3 / AlNDENSITY
3.30-3.70 g/cm3COLOR
white / grey▼Key Advantages:
Ultra-High Thermal Conductivity: AlN ceramic offers exceptional thermal conductivity (theoretical value ~320 W/mK, practical: 170–220 W/mK), far exceeding alumina ceramics. This enables rapid, uniform heat transfer from heating elements (e.g., resistor circuits) to target surfaces, minimizing thermal stress while improving efficiency and temperature uniformity.
Excellent Electrical Insulation: High insulation strength and resistivity ensure safety, especially in high-voltage or electrically isolated applications.
Low Thermal Expansion Coefficient: Matches silicon chips (semiconductors), providing reliable thermal compatibility when heating/controlling temperature for semiconductor devices (e.g., IGBTs, lasers).
High Mechanical Strength & Hardness: Delivers robust structural support and durability.
High-Temperature & Corrosion Resistance: Stable performance in high temperatures (>800°C long-term) and harsh chemical environments.
Low Dielectric Constant/Loss: Ideal for high-frequency applications.
▼Typical Applications:
Semiconductor Manufacturing & Testing: Wafer chucks, probe station hot plates, package testing.
Thermal Management for High-Power Electronics: Heat-spreading substrates for IGBT modules, laser diodes (LD), and high-power LEDs (often with integrated thin/thick-film heating circuits).
Precision Instruments: Equipment requiring fast, uniform, stable heating (e.g., analytical instruments, vacuum components).
High-Temperature Sensor Packaging Bases.
DPCs consist of a ceramic substrate such as Al2O3 (aluminium oxide) and AlN (Aluminum Nitride) serving as an insulating layer, and copper connections to ensure the electrical conductivity at high temperatures. For optimal reliability and performance, the module must demonstrate good properties in relation to heat dissipation to the heat sink and endurance against thermal cycling and power cycling. MATERIAL Al2O3 / AlN DENSITY 3.30-3.70 g/cm3 COLOR white / grey Can be customized according to your requirements.
Details
AlN has excellent electrical insulation and high thermal conductivity, is thus considered as high performance electronic packaging material. UNIPRETEC offers a series of substrates based on AlN materials for use in application environments. MATERIAL : Aluminum Nitride COLOR : Grey DENSITY : 3.30 g/cm3 THERMAL CONDUCTIVITY : > 170 W/m.K MAX. SERVICE TEMPERATURE : 1200 degree C TYPICAL ADVANTAGES : High Thermal Conductivity Can be customized according to your requirements.
Details
AlN has excellent electrical insulation and high thermal conductivity, is thus considered as high performance electronic packaging material. UNIPRETEC offers a series of substrates based on AlN materials for use in application environments. Material : Aluminum Nitride Color : Grey Density : 3.30 g/cm3 Thermal Conductivity : > 175 W/m.K Max. Service Temperature : 1200 degree C Typical Advantages : High Thermal Conductivity Can be customized according to your requirements.
Details
Aluminum nitride heating ceramic plates are heating elements or heater carriers made using aluminum nitride ceramics as the substrate or core component. MATERIAL Al2O3 / AlN DENSITY 3.30-3.70 g/cm3 COLOR white / grey Can be customized according to your requirements.
Details
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