DPCs consist of a ceramic substrate such as Al2O3 (aluminium oxide) and AlN (Aluminum Nitride) serving as an insulating layer, and copper connections to ensure the electrical conductivity at high temperatures. For optimal reliability and performance, the module must demonstrate good properties in relation to heat dissipation to the heat sink and endurance against thermal cycling and power cycling.
MATERIAL
Al2O3 / AlN
DENSITY
3.30-3.70 g/cm3
COLOR
white / grey
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IPv6 network supported