Zirconia ceramics (ZrO₂) possess exceptional physical, chemical, and biological properties, making them an ideal material for various medical applications. The following summarizes their core properties and typical applications.   1. Excellent Biocompatibility Non-toxic and non-allergenic: Zirconia does not produce rejection reactions with human tissues and does not release harmful ions, unlike certain metal alloys such as nickel-chromium.   Chemically inert and stable: It will not corrode or degrade in the physiological environment (more reliable than absorbable materials), allowing for safe long-term implantation in the human body.   Application Case:The incidence of tissue inflammation around zirconia implants is 60% lower than that around titanium alloy implants in dental applications.   2. Mechanical Performance Advantages Characteristics Value Medical Significance Flexural strength 900–1200 MPa Withstand high-frequency operation of surgical instruments Hardness (Vickers) 1200–1400 HV Maintain sharpness of surgical tools (e.g., surgical blades) Elastic modulus 200–210 GPa Similar to bone, reduces stress shielding in orthopedic implants   Application Cases: Artificial hip joint femoral head (wear rate < 0.1 mm/year) Minimally invasive surgical forceps (service life three times longer than stainless steel)   3. Chemical Stability Corrosion resistance: Excellent resistance to body fluids and disinfectants such as hydrogen peroxide and ethylene oxide.   High-temperature stability: It can be safely used in 134 °C sterilization, performing better than polymer-based instruments.   Application Case:Used in laparoscopic and robotic surgical instruments, such as electrodes and surgical forceps, where corrosion resistance and insulation minimize tissue adhesion and enhance surgical precision. Laparoscopic instruments show no performance degradation after 500 sterilization cycles.   4. Functional Properties Electrical insulation: Suitable for high-frequency electrosurgical scalpels and ultrasonic knife heads to prevent current leakage.   Low thermal conductivity: Reduces thermal damage to surrounding tissues during energy-based surgical procedures.   Surface modification: Polishing (Ra < 0.05 μm) or coating can reduce bacterial adhesion by up to 70%.

As being intelligence and electrification in various industries, ceramic substrates have become an indispensable foundational material in power electronics, semiconductor packaging, and microelectronics. These products act as key of electronic components, serving as packaging and interconnect materials used to support, connect, dissipate heat, and protect them. With independent R&D system and comprehensive production processes, novatekxm offers high-performance ceramic products for a variety of applications, including 96% aluminum oxide (Al₂O₃), aluminum nitride (AlN), zirconium oxide (ZTA), and silicon carbide (Si₃N₄) substrates.   Multi-series product matrix, accurately matching diverse application needs  novatekxm provides ceramic substrates made of different materials to meet different customer applications:   1.96 Alumina (Al₂O₃) Features: Low warpage, High thermal shock resistance, low warpage, high-temperature and resistant to acid and alkali corrosion, and excellent processability. Applications: Thick/thin-film chip resistors, low-power LEDs, energy storage, and charging station substrates.   2. Aluminum Nitride (AlN) Features: High thermal conductivity, high breakdown voltage and thermal expansion coefficient close to that of silicon wafers. Applications: Heat sinks, High-power IGBT modules, high-power LEDs.   3. Zirconia Toughened Alumina (ZTA) Features: High strength, high reflectivity, high thermal shock resistance, and excellent for processing. Applications: Medium-power power modules, medium-power LEDs, and instruments.   4. Silicon Nitride (Si₃N₄) Features: High thermal conductivity, high strength and toughness, coefficient of thermal expansion close to that of silicon wafers. Applications: High-power IGBT modules, high-power heat sinks, and wireless modules.   Technological advantages across the entire industry chain, fully controlling the foundation of quality     1. Powder material is independent and controllable   novatekxm starts from the source, and its powder materials are independently controllable and of stable quality. The powder has high purity and low impurity content, which can realize batch production of powder, enhance stability, and better ensure the high consistency and stability of key parameters such as thermal conductivity and strength of the product.       2. Various molding processes Proficient in various advanced ceramic forming technologies such as tape casting, dry pressing, isostatic pressing, etc., and able to select the most appropriate process according to the shape, size and performance requirements of the product, for better precision processing.   Specifications and dimensions：   Material Unit Al2O3 ZTA AlN Si3N4 Effective size（A、B） mm 50.8-190 50.8-190 50.8-190 138*190 Thickness（T） mm 0.25-1.5 0.25-1.5 0.25-1.0 0.25、0.32 Thickness Tolerance mm ±5% （Min±0.03mm） ±5% （Min±0.03mm） ±5% （Min±0.03mm） ±5% （Min±0.03mm） Warp（C） mm ≤0.3% ≤0.3% ≤0.3% ≤0.3% Surface Roughness μm 0.2-0.6 0.2-0.5 0.2-0.75 0.2-0.75 Customizable in size, thickness, and surface roughness   Customizable in size, thickness, and surface roughness   3. Precision machining capabilities Equipped with advanced equipment such as laser processing and grinding and polishing, it can achieve micron-level precision dimensional processing and ultra-low surface roughness (Ra value can reach nanometer level), meeting customers’ strict requirements for substrate shape, hole position and surface condition.   4.Strong independent R&D and customization capabilities With more than 40 patents and contituing technical improvment, novatekxm’s R&D team can customize ceramic substrates with different thicknesses and performance parameters based on customers’ specific needs, providing one-stop solutions   5. Complete quality management system With the IATF16949 automotive quality management system certification and a full-process quality control mechanism we are aimed to ensure that each substrate has stable performance and reliability. At the same time, we are equipped with a full range of precision testing and analysis instruments to assure high-standard quality.   Focusing on providing customers with a wide range of high-quality ceramic substrate products novatekxm offer one-stop ceramic substrate solutions, from standard parts to customized solutions. For more information on these products, please consult with info@novatekxm.com.    

Ceramic packaging stands out as the material of choice for optical communication, power devices, high-reliability military and aerospace systems, and automotive electronics, thanks to its exceptional thermal performance, excellent dielectric properties, and hermetic sealing capability. Unlike plastic packages, ceramic solutions excel in high-temperature and harsh environments, as well as applications demanding long service life and high reliability. Moreover, ceramic package housings can be tailored into a variety of structural forms to perfectly match the specific characteristics and operating conditions of different devices.   1. Ceramic Small Outline Package (CSOP)     The CSOP (Ceramic Small Outline Package) is a commonly used miniature surface-mount package. Its leads extend from both sides, with pitch options including 1.27 mm, 1.00 mm, and 0.80 mm. CSOP offers advantages such as low manufacturing cost, excellent performance, high reliability, compact size, light weight, and high packaging density.   Features:Miniaturized design with gull-wing leads, minimizing stressExcellent resistance to mechanical shockMultiple lead pitches available: 1.27 mm, 1.00 mm, 0.80 mm   Applications:Various integrated circuits, high-reliability component packaging   2. Ceramic Surface-Mount Power Package (SMD)     Designed for power devices and high-heat-flux components—such as power semiconductors, resistors, and power ICs—the ceramic SMD package provides extremely low thermal resistance pathways and excellent thermal contact surfaces, allowing heat to be rapidly conducted to the PCB or heatsink.   Features:High current-carrying capabilityLarge chip bonding area serving as an efficient heat sinkReliable performance with superior thermal management   Applications:Microwave device housingsCrystal and oscillator device packages   3. Ceramic Dual In-line Package (CDIP)     The CDIP (Ceramic Dual In-line Package) is one of the most widely used through-hole packages. It consists of two pressed ceramic blocks enclosing a dual in-line lead frame, with leads extending from both sides of the package. Standard lead pitches are typically 2.54 mm, and the number of leads ranges from 6 to 64. CDIPs offer excellent thermoelectric performance and high reliability.   Features:Dual in-line lead configurationWide range of lead counts   Applications:Various integrated circuits with moderate pin-out and assembly density requirementsOptocouplers, MEMS devices, and other high-reliability components   4. Ceramic Leadless Quad Packages (CLCC / CQFN)     CLCC (Ceramic Leadless Chip Carrier) and CQFN (Ceramic Quad Flat No-leads) belong to the leadless or no-exposed-lead quad package family. They are ideal for high-frequency, low-parasitic inductance applications that require efficient thermal dissipation and high-reliability integrated circuit packaging.   Features:Low parasitic parameters with compact sizeExcellent thermal management and high reliabilityAvailable in dual-side or four-side lead configurationsMultiple lead pitch options: 1.27 mm, 1.00 mm, 0.50 mm, etc.   Applications:High-density surface-mount applicationsVarious VLSI, ASIC, and ECL circuits   5. Laser SMD Ceramic Packages   The core function of laser device ceramic packages is optical control. Their purpose is to safely encapsulate a light-emitting or light-receiving chip while efficiently and reliably transmitting optical signals to the outside, and effectively managing the heat generated. Proper thermal management in laser packages ensures a stable, optimal operating temperature, thereby maintaining wavelength stability and consistent output power.   Features:High thermal conductivity with excellent chip protectionStable performance and reliable driving capabilityCompact 7 mm surface-mount design with built-in safety featuresEnables long projection distances, narrow beam angles, and small optical dimensions   Applications:Portable exploration and rescue lightingAutomotive and architectural lightingOutdoor and entertainment lighting   6. Optical Communication Package Series (ROSA / TOSA, etc.)   ROSA (Receiver Optical Sub-Assembly) and TOSA (Transmitter Optical Sub-Assembly) are critical submodule packages in optical device modules (such as SFP/QSFP) that house key optoelectronic components—including laser diodes, photodiodes, and fiber coupling windows. Ceramic ROSA/TOSA packages are commonly used in applications requiring high frequency, high-speed operation, excellent thermal management, and hermetic window sealing.     Features:High hermeticity with extremely low leakage, ensuring a stable internal optical environmentExcellent thermal management for extended service lifeSupports a wide range of data rates from 10 GHz to 400 GHzCustomizable design to meet specific user requirements   Applications:Fiber-optic communication systemsVarious optoelectronic transmitter and receiver devicesOptical switches, modules, and high-power laser systems   novatekxm offers a one-stop ceramic packaging solution, ranging from standard components to fully customized designs. From material selection, ceramic processing, metallization, and sealing, to hermeticity and reliability testing, we work closely with customers to develop prototypes and scale up to mass production.

As a hot-pressed hexagonal material, boron nitride (BN) exhibits a distinctive combination of chemical, electrical, mechanical, and thermal characteristics, making it ideal for demanding high-performance applications. BN ceramic nozzles are widely employed in high-temperature and high-performance industries such as aerospace and semiconductors. In recent years, these components have attracted significant interest owing to their following unique properties: 1.Exceptional Thermal StabilityWith melting point of approximately 2900°C, BN ceramic nozzle can be used for temperature 1800 °C and 2100°C separately in high vacuum and inactive gas environment. 2.Thermal Shock ResistanceBN nozzles can withstand rapid temperature changes without cracking. So it can be used in environments with dramatic temperature fluctuations dramatically. 3.Extreme Corrosion ResistanceBoron Nitride ceramic has high resistance to chemical corrosion like acids and alkalis. It can protect the nozzle from the materials it handles to reduce the risk of contamination and extend lifespan. 4.Self-lubricatingBN material is self-lubricating. It can make sure molten materials do not adhere to the nozzle, preventing clogging and ensuring smooth material flow. 5.Electrical InsulationBN is an excellent electrical insulator, so it is suitable for applications like high voltages or plasma.   Material Property Material Composition BN+ZrO2 99 BN Density 2.8–2.9 g/cm³ 2.0 g/cm³ Color White Graphite White Bending Strength 90MPa 35MPa Compressive Strength 220MPa 85MPa Thermal Conductivity 30 W/(m.k) 40 W/(m.k) Thermal Expansion Coefficient  (20-1000°C) 3.5 10-6/K 1.8 10-6/K Max working temperature In Inert Gas 1800 °C In Inert Gas 2100 °C   In High Vacuum 1800 °C In High Vacuum 1800 °C   In Atmosphere  900 °C In Atmosphere 900 °C   With exceptional thermal stability, excellent thermal shock resistance, outstanding electrical insulation, chemical inertness, and lubricity, we have developed a new series of nozzles for metal and glass processing, 3D printing, as well as applications in the semiconductor and aerospace industries.   1.Metal and Glass ProcessingBN nozzle is widely used in metal casting and glass manufacturing, where it is exposed to molten metals and glass in high temperature. BN’s high wet resistance to molten metals and glass, its chemical inertness guarantees smooth flow and prevent clogging. If you are looking for metal and glass processing nozzle, BN will be a good choice.   2.3D PrintingIn metal 3D printing, BN nozzles are used to deliver powdered materials or molten metals. Its thermal stability and low friction properties make sure consistent material flow, reducing wear and tear of equipment and improving print quality.   3.Semiconductor IndustryIn semiconductor industry, BN nozzles used in chemical vapor deposition (CVD) and some high-temperature processes. It is suitable to handle reactive gases and ensure precise deposition as it won’t produce chemical reaction even under extreme conditions.   4.Aerospace IndustryBN nozzle is used in rocket engines and thrusters. It has the ability to withstand extreme temperatures and resist thermal shock, which makes it an ideal use for directing high-velocity exhaust gases. The BN nozzle’s applications in metal and glass processing, 3D printing, Semiconductor and aerospace demonstrate its versatility and reliability. With its numerous advantages, BN nozzle continues to be a preferred choice for high-performance applications. Any more question about BN nozzles just feel free to contact us at +86 17759275863 or peter@novatekxm.com for more information.